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No. |
Test Item |
Standards & Condition |
| 1 |
Physical Dimension |
Mil-STD-883G，method 2016 |
| 2 |
Visual Inspection |
100% visual inspection to meet or exceed Mil-STD-883G，method 2032 requirements |
| 3 |
Conductor Thickness |
Conductor thickness to meet or exceed the customer requirements |
| 4 |
Film Adhesion |
ASTM B571-97 （Film adhesion use 3M #610 tape） |
| 5 |
High Temp. Resistance |
All general thin film products must be met customer's requirements at 400℃ for 10 mintues |
| 6 |
Wire Bond Strength |
Mil-STD-883G，method 2011 |
| 7 |
Die Shear Strength |
Mil-STD-883G，method 2019 |
| 8 |
Wire Bond Shear Strength |
EIA/JESD22-B116 |
| 9 |
Thermal Shock |
Mil-STD-883G，method 2011, condition C |
| 10 |
Customization |
Customer requirements of product quality testing are availible |
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